PCB Assembly

If you need to produce a prototype PCB or PCB Assembly, PCBQUICK can provide solutions. Different of the larger, less flexible companies, we bear all the work for our customer driven approach very proud, no matter how big or small orders.

Our friendly and knowledgeable staff are always ready to advise and advise you on any project you are considering, and investing in the latest technology means we can provide each component at the best price without compromising quality. Prototype and small batch work are ideal for contract PCB assembly, surface mounting and through hole PCB assembly.

Electronic Assembly Made capacity：

Item	Capability	Item	Capability
Solder PastePrintig	Accuracy:,±0.025mm	Wave Soldering	Nitrogen source: external
	Max. speed: 150mm/sec		Speed: 5in² /sec (60FOV/sec)
	PCB max. area: 400*310mm		Temperature accuracy: ±1°C
	PCB thickness: 0.2-6mm		Lead free compatible
SMT	Accuracy: ±0.03mm	AOI	Accuracy: ±0.0024mm
	Speed: 0.17sec/pc		Speed: 5in² /sec (60FOV/sec)
	PCB max. area: 350*350mm		PCB max. area:300*300mm
	Available part: 0201 chip to 35*35mm		Available component: 0201 chip and fine pitch
	Accuracy: ±0.05mm		Available component: 0201 chip and fine pitch
	PCB max. area: 350*350mm	X-ray,Inspection	BGA void(0.5mm distance between Ball)
	Available part: 0402 chips to 14mm (H 12mm)		BGA void(0.5mm distance between Ball)
	Minimum SMD resistor and capacitor: 0201		Solderability inner shielding
	Minimum BGA R-VTx: 0.15mm	BGA Rework	Nitrogen source: NA
	Nitrogen source: external		PCB max. size: 350mm
Reflow Soldering	Nitrogen source: external		Temperature accuracy: ±1°C
	PCB max. size: 400*330mm		Temperature accuracy: ±1°C
	Temperature accuracy: ±4°C		Lead free compatible
	Zones: 8		Lead free compatible

PCB Assembly Services:

1. 1-50 pieces of quick patch, develop sample.

2.Small batch (one piece of tape), SMT tape, DIP welding.Quick production, within 24 hours.

3.Prototype testing and delivery

4.AOI inspection and Electronic component assembly

Function test and inspection:

IQC inspection

It is forbidden to delay the delivery due to the defective materials on the line

SPI tin paste detection

Found the front process work out ahead of the next process

Online AOI detection

Check whether the product produced has the wrong leakage reverse, the bad material flows out the next procedure

SMT first piece detection

Ensure the production model of components completely with the customer by the assembly drawing, bom, prevent bad into the next process

Appearance test

Carry out spot check on all production procedures, whether it is consistent with the operation instruction

X-RAY- welding test

The welding spot of the invisible original is tested to avoid the short circuit of the virtual welding out of the next procedure

BGA device repair

X-ray detection BGA welding defects disassembly and welding under temperature controlled conditions to slow down the impact on the device and ensure the quality of rewelding

QA inspection

To conduct product inspections to prevent substandard product being shipped.

PCB Assembly Products: