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high density interconnect pcb 6Layer Blind Buried Via HDI PCB
high density interconnect pcb 6Layer Blind Buried Via HDI PCB
Detail Information
high density interconnect pcb 6Layer Blind Buried Via HDI PCB
Product Description
Board Thickness: 0.53+/-0.1mm
Soldermask Color: Green
Surface Technics: ENIG(Au min 1.2uinch,Ni min 100uinch)
Min Line width and space:3mil/3mil
BGA 0.5mm
Drill layer stack up: L1-L2,L2-L3,L3-L4,L4-L5,L5-L6,L1-L6
HDI PCB Manufacturing Process
HDI PCB Stack Up
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