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High TG Multilayer PCB printed circuit board manufacturer

High TG Multilayer PCB printed circuit board manufacturer

High TG Multilayer PCB printed circuit board manufacturer
High TG Multilayer PCB printed circuit board manufacturerHigh TG Multilayer PCB printed circuit board manufacturerHigh TG Multilayer PCB printed circuit board manufacturerHigh TG Multilayer PCB printed circuit board manufacturer
CategoriesSpecial PCB Manufacturing
BrandPCBQuick PCB Manufacturing and Assembly
ModelKF-High TG PCB
MaterialFR4 TG 170 or TG180 (Shengyi)
Board Thickness1.6mm
Copper Thickness1/1/1/1/1/1/1/1
Soldermask ColorGreen
Silkscreen ColorWhite
Surface TechnicsENIG (1-3u
FOB portShenzhen,HOngkong
Terms of PaymentL/C, D/A, D/P, Western Union, MoneyGram, T/T, Paypal
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Update TimeNov 15,2024
Detail Information

High TG Multilayer PCB printed circuit board manufacturer


Product Description

Material: FR4 TG 170 or TG180 (Shengyi)
Board Thickness: 1.6mm
Copper Thickness: 1/1/1/1/1/1/1/1
Soldermask Color: Green  
Silkscreen Color: White
Surface Technics: ENIG (1-3u")
Min Holes:0.2mm
Min Line space and width: 4/4mil


 NO ItemCraft Ability
1

Surface Finishh

HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc
2Layer2-30 layers
3Min. Line Width3 mil
4Min. Line  Space3 mil
5Min. Space between Pad to Pad3 mil
6Min.Hole Diameter0.10 mm
7Min. Bonding Pad Diameter10 mil
8Max. Proportion of Drilling Hole and Board Thickness1:12:5
9Max. Size of Finish Board23 inch*35 inch
10Rang of Finish Board's Thickness0.21-7.0 mm
11Min. Thickness of Soldermask10 um
12SoldermaskGreen,Yellow,Black,White,Red,Transparent photosensitive solder mask,Strippable solder mask
13Min. Linewidth of Idents4 mil
14Min. Height of Idents25 mil
15Color of Silk-screenWhite,Yellow,Black
16Date File FormatGerber file and Drilling file,Report series,PADS 2000 series,Powerpcb series,ODB++
17E-testing100% E-Testing:High Voltage Testing
18Material for PCB

High TG Material:High Frequence

(ROGERS,TEFLON,TADONIC,ARLON):Halogen-free Material 

19Other TestImpedance Testing,Resistance Testing,Microsection etc
20Special Technological RequirementBlind&Buried Vias and High Thickness Copper

8Layer Multi-layer circuit board structure

Inner Layer Core thickness:0.2MM
Finished board thickness:1.5±0.1MM
          _____________________  H   (Copper)
             _______________     2116*2(4.6mil*2) (PP)
0.2MM(core+copper)
             _______________     7628M*1(7.5mil) (PP)
 0.2MM(Core+copper)
             _______________     7628M*1(7.5mil) (PP)
0.2MM(Core+Copper)
             _______________     2116*2(4.6mil*2) (PP)
          _____________________  H   (Copper)


A: The minimum order quantity of circuit board is 5pcs.

Q: What the package of the products?

A: Of course, we can do different boards on the same panel.

A: Such as ENIG, Plating Gold, HAL-LF, Chem.Tin, Chem.Ag and OSP

Q: How to get the PCB?

A: For small production, we will ship the boards to you by DHL, UPS, or EMS. Door to door service. You can get your PCBs at home.For heavy goods more than 300kg, Shipped by Sea or By Air, you can saving freight cost.Of course, if you have your own forwarder, we may contact them to deal with your shipment.

A: 8-layer pcb board sample delivery time is 120 hours,and the mass production lead time is 10 days

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