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Double Layer PCB Board for LED pcb board design
Double Layer PCB Board for LED pcb board design
Detail Information
Double Layer PCB Board for LED pcb board design
Product Description
Material: FR4
Board Thickness: 1.6mm
Copper Thickness: 50um
Soldermask Color: Green
Silkscreen Color: White
Surface Technics: ENIG
Min Holes:0.2mm
Min Line Width and space:5mil/5mil
FR4 Made Ability
NO | Item | Craft Ability |
---|---|---|
1 | Surface Finishh | HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc |
2 | Layer | 2-30 layers |
3 | Min. Line Width | 3 mil |
4 | Min. Line Space | 3 mil |
5 | Min. Space between Pad to Pad | 3 mil |
6 | Min.Hole Diameter | 0.10 mm |
7 | Min. Bonding Pad Diameter | 10 mil |
8 | Max. Proportion of Drilling Hole and Board Thickness | 1:12:5 |
9 | Max. Size of Finish Board | 23 inch*35 inch |
10 | Rang of Finish Board's Thickness | 0.21-7.0 mm |
11 | Min. Thickness of Soldermask | 10 um |
12 | Soldermask | Green,Yellow,Black,White,Red,Transparent photosensitive solder mask,Strippable solder mask |
13 | Min. Linewidth of Idents | 4 mil |
14 | Min. Height of Idents | 25 mil |
15 | Color of Silk-screen | White,Yellow,Black |
16 | Date File Format | Gerber file and Drilling file,Report series,PADS 2000 series,Powerpcb series,ODB++ |
17 | E-testing | 100% E-Testing:High Voltage Testing |
18 | Material for PCB | High TG Material:High Frequence (ROGERS,TEFLON,TADONIC,ARLON):Halogen-free Material |
19 | Other Test | Impedance Testing,Resistance Testing,Microsection etc |
20 | Special Technological Requirement | Blind&Buried Vias and High Thickness Copper |
PCB Certificates
UL, TS16949, ISO14001, ISO9001-2008, and RoHS
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