8 Layer Multilayer PCB Fabrication Printed Circuit Board-pcbquick

Categories	Multilayer PCB Manufacturing
Brand	PCBQuick PCB Manufacturing and Assembly
Model	KF-FR4 PCB-06
Material	FR4
Board Thickness	1.6mm
Soldermask Color	Black
Silkscreen Color	White
Surface Technics	ENIG
Min Holes	0.2mm
Min Line space and width	5/5mil
FOB port	Shenzhen,Hongkong
Terms of Payment	L/C, D/A, D/P, Western Union, MoneyGram, T/T, Paypal
Download
Update Time	Nov 15,2024

Contact Now

Favorites

Detail Information

8 Layer Multilayer PCB Fabrication Printed Circuit Board

Product Description

Material: FR4 Multilayer PCB Fabrication
Board Thickness: 1.6mm
Soldermask Color: Black
Silkscreen Color: White
Surface Technics: ENIG
Min Holes:0.2mm
Min Line space and width: 5/5mil

FR4 Made Ability

NO	Item	Craft Ability
1	Surface Finishh	HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc
2	Layer	2-30 layers
3	Min. Line Width	3 mil
4	Min. Line Space	3 mil
5	Min. Space between Pad to Pad	3 mil
6	Min.Hole Diameter	0.10 mm
7	Min. Bonding Pad Diameter	10 mil
8	Max. Proportion of Drilling Hole and Board Thickness	1:12:5
9	Max. Size of Finish Board	23 inch*35 inch
10	Rang of Finish Board's Thickness	0.21-7.0 mm
11	Min. Thickness of Soldermask	10 um
12	Soldermask	Green,Yellow,Black,White,Red,Transparent photosensitive solder mask,Strippable solder mask
13	Min. Linewidth of Idents	4 mil
14	Min. Height of Idents	25 mil
15	Color of Silk-screen	White,Yellow,Black
16	Date File Format	Gerber file and Drilling file,Report series,PADS 2000 series,Powerpcb series,ODB++
17	E-testing	100% E-Testing:High Voltage Testing
18	Material for PCB	High TG Material:High Frequence (ROGERS,TEFLON,TADONIC,ARLON):Halogen-free Material
19	Other Test	Impedance Testing,Resistance Testing,Microsection etc
20	Special Technological Requirement	Blind&Buried Vias and High Thickness Copper