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FR4 2.8mm stepstair PCB Circuit Board
FR4 2.8mm stepstair PCB Circuit Board
Detail Information
Description
Layers: 2 Layer
PCB Material: FR4 TG130
Board Thickness: 2.8mm
Surface Finishing: ENIG(Gold thickness 2u”)
Finished Copper thickness: 1/1 OZ
Solder mask: Blue
PCB Material: FR4 TG130
Board Thickness: 2.8mm
Surface Finishing: ENIG(Gold thickness 2u”)
Finished Copper thickness: 1/1 OZ
Solder mask: Blue
Slikscreen: White
Standard PCB Capability:
Minimum Circuit Trace Width/Space: 3/3mil |
The Minimum Via Size: 0.2mm |
The Minimum Legend Height/Width: 0.5mm/0.15mm |
Surface Finishing: HASL-LF, ENIG, ENEPIG, OSP, Gold Finger, Hard Gold Plating, Immersion Silver, Immersion Tin |
Special Technology: Blind&Buried Via, Via In Pad, Backdrill, Small BGA PAD, Impedance control, Heavy Copper, Copper Filled Vias, Countersink hole, Depth Milling |
Material Type: FR4, Metal Core, Halogen Free, FR4 High TG, Rogers, PTFE, Arlon, Nelco, Polyimide |
Final Board Thickness: 0.2mm - 6.0mm |
Final Copper Thickness: HOZ, 1OZ, 2OZ, 3OZ, 4OZ, 5OZ, 6OZ, 10OZ |
FR4 Substrate Thickness: 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 2.36mm, 2.8mm | Shaping: CNC Routing, Punching, V-CUT, Depth milling, Castellation |
Special Hole: Blind&Buried hole, Depth milling, T-slot, Countersink holes, Step holes, | Quick Turn Delivery time: 12hours for 1layer PCB, 24Hours for 2layer PCB, 48Hours for 4layer PCB, 72hours for 6layer PCB |
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